The equipment utilizes laser grooving and cutting on the surface of a wafer，with humanized operation design to improve user experience and intelligent software system to improve production efficiency.
Equipment Advantage
01
Equipped with high precision linear motor and high speed X-Y motion platform
02
Equipped with special customized laser head, which ensures high cutting quality and low heat influence
03
The software is easy to operate and the equipment is convenient to maintain
04
The cutting mode can be freely combined by narrow beam and wide beam, equipped with a single focus lens cutting system which can improve the processing stability
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Equipment Picture
Basic Parameters
1. Applicable Products：Low-K, CMOS, etc
2. Applicable wafer size：200mm-300mm
3. Laser head：UV nanosecond or short pulse custom laser head
4. Cutting depth：≥10μm
5. Cutting speed：0-1000mm/s
6. Processing method：full-automatic
7. Cutting width： 30~90μm
8. Equipped with backlight chuck table which has better edge alignment
