大奖国际

      LED Wafer Laser Surface Cutting Equipment
      The equipment is applied in cutting processing of LED silicon wafer (red or yellow light), or slotting of sapphire or SiC material. It utilizes ultraviolet laser ablation removal process, which comprises automatic loading and unloading units, glue cleaning unit, laser cutting unit, alignment unit and control unit.
      Main Advantages
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        Equipped with high precision linear motor, high speed X-Y movement platform
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        With multi-point cutting technology for high-efficiency and high-quality processing
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        With automatic cleaning and gluing function
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        Unattended fully automatic processing, that can also be used for debris
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      Equipment Picture
      Basic Parameters
      • 1. High cutting accuracy: Cutting offset ≤ 1.5μm
      • 2. High cutting efficiency: Max machining speed 500mm/s
      • 3. Cut depth to width ratio:5: 1 (cut depth 40μm, cut width 8μm）
      • 4. Machinable product dimensions: 2~ 6 inches of wafers
      • 5. Equipped with automatic cleaning and coating function; with upper and lower CCD, that can be used for front and back cutting processing
      • 6. Easy maintenance of the equipment: utilizing bus control system and self-diagnosis system, with low failure rate, high stability and high maintainability
      • 7. Design/Manufacturing/Maintenance integration to ensure the consistency, stability and rapid responding of the equipment
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