1. 大奖国际

    High-speed off-line Laser-assisted Selective Diffusion Equipment
    The research and development project of double-track laser-assisted selective diffusion (SE) for fully automatic solar cells adopts imported lasers, high-speed galvanometer systems, multi-group CCD vision systems and existing turntable technology to improve the performance of the cells, and ensure the same entry and exit of the cells, without affect of the whole line CT after being assembled on the line.
    Equipment Parameters
    • 01
      With 4 stations of high-speed DD turntable coordinate processing to improve CT of the whole line, and the flatness of table top of turntable 4 is within 30um, which provides guarantee for the stability of the process
    • 02
      High-speed galvanometer scanning, the galvanometer scanning speed is ≥60m/s, the precision can reach ±15um, and the digital control mode is adopted, which greatly improves the laser marking efficiency
    • 03
      Compatibility of process graphics (lines, segments and points)
    • 04
      The spot size (window opening size) can be adjusted from 90 to 130 um, and can be selected as round or square
    • 05
      The laser wavelength is 532nm, the power is ≥25-60W (optional), the power stability is ≤2%RMS, the rate adjustment range is 50-500 KHz, and the pulse width is 3-50ns
    • 06
      Two-track independent control, two lasers and four lasers can be selected to achieve higher productivity
    Equipment Picture
    Basic Parameters
    • 1. Equipment Size : 5000mm x 2500mm x 2260mm
    • 2. Silicon Wafer Size : 156mm x 156mm ~ 230mm x 230mm , Thickness : 140~220μm
    • 3. Four-head Productivity : M10≥9500PCS/H ; M12 ≥8000PCS/H(Compatible with 230mm wafer , higher production capacity of four laser heads optional)
    • 4. Breakage Rate ≤ 0.05%(Except for cracks of incoming materials)
    • 5. Uptime ≥ 95%
    • 6. Laser Wavelength : 532nm
    • 7. Laser Frequency ＞ 500Khz
    • 8. Laser Power : 25w~60W
    • 9. Power Stability ＜ 2% RMS
    • 10. Laser Lifetime ≥ 50000小时
    • 11. Scan Mode : Galvanometer Scanning
    • 12. Spot Size : 90 ～ 130um(Round/square optional; size optional)
    • 13. Scanning Speed ≥ 50m/s
    • 14. Graphic Marking Accuracy ≤±15μm(incoming material)
    • 15. Loading Breakage Detection : 12 million pixels (general) , Edge collapse and corner missing detectable
    • 16. Graphics Compatibility : Compatible with plt, dxf, dwg graphics formats(Compatible with points, lines and segments)
    • 17. Dust Removal and Filtration Efficiency : Dust removal eff. ≥95%; filtration eff. ≥99%(Independent dust removal equipment, exhaust air volume up to 2000m3/h)
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